SMT placement machine operation safety rules

1) The machine operator should receive operational training under the correct method.
2) Check the machine, replace parts or repair and internal adjustment should be turned off (the machine must be repaired by pressing the emergency button or power off).
3) Make sure to read the coordinates and adjust the machine when the YPU (programming part) is in your hands to stop the machine at any time.

SMT placement machine basic operation process

SMT placement machine basic operation process
SMT placement machine workflow: board and marker recognition -> automatic learning -> nozzle selection -> feeder selection -> component pick -> component inspection to evaluate -> placement -> nozzle homing -> out board

PCB Pick and place technology and feature

The complex issues surrounding component placement include equipment usage, throughput, product conversion time, footprint constraints, total operating costs, and emerging cutting-edge technologies. This article focuses on some of the features that affect the placement of components.

PCB Parts function and feature

1） Process Control Block: The function of the process control block is to make a program (including data) that cannot run independently in a multi-program environment, become a basic unit that can run independently, and a process that can be executed concurrently with other processes.
2） block: is the program code segment in the process that can be executed by the process scheduler on the CPU.

The latest complex technology in the SMT industry

CSP, 0201 passive components, lead-free soldering and optoelectronics are arguably the most advanced technologies that many companies have recently practiced and positively evaluated on PCBs. For example, how to handle the ultra-small openings commonly found in CSP and 0201 assembly (250um) 

Electronic component process design and product design trends

Electronic component process design and product design trends

Product design has traditionally driven the design trend due to its increasing demand for functionality and miniaturization. Today, electronic manufacturing processes are becoming more complex. In 2001, market leaders will steer clear of the need for product design and focus on process design to achieve innovation and technological gains.

Electronic component miniaturization trend

According to this BOLG, product designers are increasingly specifying smaller components to achieve higher board density and provide more product features. The increase in the use of 0201 components has a dramatic impact on PCB “real estate” and provides a positive investment opportunity for manufacturers who have previously failed to invest in miniaturization trends.

Electronic component placement

What is the general trend of chip component technology? This problem is actually quite simple: the size of the chip components and their packaging is getting smaller. In fact, the 0603 packaging form (side length: 1.5 x 0.75 mm) is the mainstream. And the 0402 patch (side length: 1.0 x 0.5 mm) ) Gradually more common, especially in the telecommunications industry.