Electronic component process design and product design trends

Product design has traditionally driven the design trend due to its increasing demand for functionality and miniaturization. Today, electronic manufacturing processes are becoming more complex. In 2001, market leaders will steer clear of the need for product design and focus on process design to achieve innovation and technological gains.

This trend in process design is revolutionizing the use of the 0201. Not a reactive approach - incorporating 0201 into PCB assembly - PCB manufacturers are increasingly taking an aggressive approach to the use of 0201. They evaluate the entire process through its long-term viability for a specific 0201 application rather than short-term adoption.

Success through strategy
Increased attention to process design also means that more attention can be placed on larger aspects, such as controlling millions of errors in parts and achieving maximum precision and reliability, all of which can add significant benefits. To achieve this, contract manufacturers (CMs) must consider strategic considerations for the entire need for 0201 placement, such as PCB design, silk screen, placement, reflow and testing, and inspection.

This is critical because process and product design are equally important, but are often overlooked. Now and in the future 0201 users will be challenged to achieve the optimal parameters necessary for the best 0201 placement, while weighing the profit factors, such as the error rate.

Get the challenge of 0201 capabilities
The acquisition of knowledge. CM often has a time-based shipping schedule that limits CM's ability to conduct viable research into high-density work. They need to assess what constitutes the minimum investment, the type of cost, the misplacement rate, and the expected profitable figures. Here are some basic time-saving solutions to this puzzle:

In order to quickly start on the learning curve, direct contact with equipment suppliers who have concentrated research and practical production experience in electronic miniaturization.
Work with companies that have used 0201, eliminated process improvement stumbling blocks, and can provide research and development resources to help implement appropriate strategies in high-density markets to reduce the risk of adopting new technologies.
The best return on investment is not started by paying the partner's learning curve, but by weighing the partner's knowledge with the market advantage.

The acquisition of equipment. The PCB assembly market has traditionally been divided into suppliers of different levels or grades. The level of financial commitment has gradually increased with each level and level of complexity. In 2001, this is expected to change as the equipment market will change radically. Demand is increasing, technology is easier to obtain, and market development has reached a non-traditional, non-hierarchical relationship. OEMs and CMs that were previously unable to afford high-density markets will find new options and resources that can be leveraged because the 0201 placement capability quickly becomes a difference and a competitive advantage.

Enhance the challenge of 0201 capabilities
Component and pickup quality. Component manufacturers are responding to demand to improve quality and thus reduce the number of mis-picking. Studies of pick-up error rates involving 0201 components, equipment, operator influence, and programming have pointed out that some of the root causes of errors are the components themselves and the carrier tape.

When focusing on 0201 components, key parameters include shape (length, width, and square) and surface (irregularity on the electrode). The carrier itself is also an important factor in the loss rate, and different aspects, such as the top band and the carrier tape, need to be carefully considered. The Create team, along with its factory in Japan, has made some recommendations for component dimensions and carrier dimensions and carrier tape tolerances (Figures 3a, 3b).

Figure 4

 size specifications of 0201 tape

New developments in the 0201 pick and place specifications. In order to improve the quality, the suction mechanism requires careful examination of the position of the sheet member relative to the nozzle, as well as the strength and speed of the pickup. We used a 0.1 second beat time (36,000 cph) in the test. Picking errors during testing can be attributed to offsets in the X, Y, and Z directions. To further define the 0201 mounting specifications, we tested the following criteria: the offset in the X direction is greater than 0.15 m (0.006"), the offset in the Y direction is greater than 0.15 m (0.006"), and the control in the Z direction 0-0.15m (0.006").

In order to ensure proper suction procedures without damaging the components and allowing proper visual inspection of the components, we define the following specifications:

±0.02mm X and Y repeatability
The device has suction compensation on X and Y
Height controlled by each feeder slot
The feeding accuracy of the material is ±0.05mm
A key factor in the suction mechanism is that the Z-axis control is consistent with the height of the feeder. In order to improve the suction and avoidance of damage to these low-weight components, it has been untested to test that a "suction gap" is programmed at the tape feeder. This is a gap between the nozzle and the top surface of the component (the component is inside the pocket). The process requires a method of "sucking" the part from the pit to achieve a more reliable suction.

New developments in the 0201 placement. As the trend toward higher density component placement pushes the spacing standard to 0.15 mm, pick and place equipment for 0201 is being challenged to accommodate increasingly tight tolerance requirements in real world production environments. In order to achieve this new 0.15mm 0201 spacing standard, the pick and place equipment must maintain a processability index (Cpk) greater than 1.5 for a 3σ 0.05mm accuracy level, and a process capability index (Cpk) greater than 1.67 for a 6σ 0.10mm accuracy. Level.

Process capability
Cpk =USL-LSL/12ó

(ó = process variable  USL = upper limit of statistics  LSL - lower limit of statistics)

Focus on the new 0201 device. This should start with a commitment to assess a supplier's high-density industry. Equipment should be designed specifically for PCB miniaturization, not just for adjustment. Machines that can handle sizes larger than 18"x20" and machines loaded with 0201 should be consulted. Suppliers should have machines that now use 0201 in production.

When evaluating equipment capabilities, it is important to know that demonstrations on double-sided tape do not represent a real-world production environment and, therefore, are not sufficient to demonstrate the capabilities of the equipment. With double-sided tape, nozzle interference on adjacent components cannot be confirmed or evaluated. Nozzle interference may be an important cause of misplacement. The smallest nozzles and contours will provide the most accurate placement without interference and allow for increased space flexibility.

There are several other key factors to consider: the reliability of the suction and the problems of the tape, the size and shape of the components, the ability of the machine to pick up without harm from the feeder, and the visual inspection equipment. Once absorbed, the spacing of the components plays a large role in product quality. Equipment must be able to accurately mount 0201 components at a precise 0.15mm interval as this quickly becomes a key industry requirement.

As 0201 is specified in a large number of products, the component spacing will also become a different point in the middle of the CM. Primarily, this is because the driving factor for miniaturization and high-density manufacturing is the reduction in size - either to accommodate more functions, or to reduce the overall size of the final product, or both. These goals cannot be effectively achieved if the 0201 component is placed with an interval parameter of 0402.

Seize the trend of market opportunities. Long-term investment in equipment should be determined by predicting demand - whether it can meet future demand requirements. The trend to reduce size and increase functionality in the PCB may remain mainstream in market demand and industry trends - and may provide an opportunity for CM to continue to grow profits. As industry shifts its focus from product to process design, the cost of technology acquisition will decrease. CMs that were previously unable to afford to compete will have new opportunities to invest in fixed assets on the trend of miniaturization.