Electronic component miniaturization trend

According to this BOLG, product designers are increasingly specifying smaller components to achieve higher board density and provide more product features. The increase in the use of 0201 components has a dramatic impact on PCB “real estate” and provides a positive investment opportunity for manufacturers who have previously failed to invest in miniaturization trends.

The demand for 0201 components is in a period of rapid increase. For example, it is expected that by 2003, more than 100,000 mobile phones will be manufactured in the world, including more than 20 billion 0201 components. More manufacturers will be needed to meet this huge demand, and in the equipment market, the accompanying changes may allow such investments by those who were previously unable to invest in high-density components.

Incremental complexity, decreasing space
The trend among product designers is to specify smaller components, thereby increasing density, reducing board size, and improving product functionality. This is happening in a variety of products. A personal digital assistant (PDA) can now surf the web and have the functionality of a mobile phone. Digital cameras have become smaller, offering clearer photos and larger memory; even toys are using more advanced chip design and technology.


As a result of this trend, 0201 may become a solution for countless consumer electronics choices as it provides dramatic improvements in product miniaturization and functionality. In general, when turning from 0603 to 0402 components, the package size is reduced by 64%. If a pitch of 0.15 is used, a 67% size reduction can be achieved. The 0201 offers even greater size savings, such as the ability to reduce common cell phone boards by more than 50% without changing the board design.

0201 production trend
Mobile phones that can be used on the Internet require a high level of functionality, which is pushing the component spacing to a much tighter level. Figure 2 shows that just a voltage controlled oscillator manufacturer between April 1999 and April 2000, the 0201 component placement increased by 6,500,000 (from 500,000 to 7,000,000). In today's production, some manufacturers are achieving good results in product designs with intervals as small as 0.15 mm. Panasonic's Create team is a device supplier that helps manufacturers achieve the best results by tightening the gap to 0.12mm. A versatile mobile device and system in package (SiP, system in package) typically uses a more robust substrate that allows 0.12 mm spacing.


Component miniaturization trend
It is clear that the projected growth in mobile phones, PDAs and digital cameras will increase the demand for printed circuit board (PCB) miniaturization and smaller components. What is not clear is the breadth of potential demand for miniaturization (including 0402) in other industries, and the pace of its demand and its acceleration. For example, in an article published in December 2000, Wall Street magazine stated that “especially electronic toys and their shortages. The shortage is not necessarily due to high demand (for toys)... but the shortage of chips in Asia is delayed. With the shipment to a wider market and increased demand for 0402 and 0201 components, other manufacturers with the ability to handle high-density components will be required to fill these expanding markets.