SMT TECHNOLOGY Summary

1. The smt placement machine component placement offset mainly refers to the position shift of the component after being placed on the PCB. The reasons for this are as follows:
(1) Reasons for PCB board
a: The warpage of the PCB board exceeds the allowable range of the equipment. The maximum upturn is 1.2MM, and the lower bend is 0.5MM.
b: The height of the support pins is inconsistent, resulting in uneven printing board support.
c: poor flatness of the workbench support platform
d: board technology '> board layout accuracy is low, the consistency is poor, especially the difference between batch and batch.

(2) The blowing pressure is abnormal during placement.
(3) The suction pressure of the mounting nozzle is too low, and the pick-up and placement should be above 400mmHG.
(4) Adhesive, welding technology'> abnormal or deviation of solder paste coating. It causes drift when the component is mounted or soldered. Too little result causes the component to be offset from the original position when the component is mounted at high speed. The position is not accurate and the corresponding offset occurs due to its tension.
(5) The program data device is incorrect.
(6) Poor substrate positioning.
(7) The coupling between the power piece and the transmission part of the X-Y table is loose.


(8) When the mounting nozzle rises, the movement is not smooth, and it is slow.
(9) The head nozzle is not properly installed.
(10) The blowing timing does not match the timing of the placement head.
(11) The nozzle center data and the initial data setting value of the camera of the optical identification system are not good.


2. The smt placement machine device placement angle offset mainly refers to the angular rotation offset when the device is mounted. The main reasons for this are as follows:
(1) Reasons for PCB board a: PCB warpage exceeds the allowable range of equipment b: The height of support pins is inconsistent, making the printed board support uneven. C: The flatness of the support platform is poor. d: The wiring of the board is low. The consistency is poor, especially the difference between batch and batch.

(2) The air pressure is abnormal during placement.

(3) The suction pressure of the mounting nozzle is too low, and the pick-up and placement should be above 400mmHG.

(4) Abnormal or deviation of the amount of adhesive and solder paste applied.

(5) The program data device is incorrect.

(6) The end of the nozzle is worn, clogged or stuck with foreign matter.

(7) Poor parallelism between the nozzle unit and the X-Y table or poor detection of the nozzle origin.

(8) The rising or rotating motion of the mounting nozzle is not smooth and slow.

(9) Optical camera installation is improper or data equipment is improper.

(10) The blowing timing does not match the timing of the placement head.