JOYSMT
JOY TECHNOLOGY CO.,LIMITED
SMT Equipment | Electronic Component Provider
judy@joysmt.com
+86-13823724660
judy@joysmt.com
+86-13823724660
Panasonic Placement Machine
Juki Placement Machine
Fuji Placement Machine
Hitachi Placement Machine
SMT Screen Printer & Parts
SMT Feeder Storage Cart
PCB Magazine Rack
SMT Feeder Calibration Jig
+86 13823724660
+86 0755-36527060
judy@joysmt.com
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13823724660
When choosing to evaluate automated SMT process equipment such as stencil printing systems, productivity, flexibility, cost effectiveness, and performance are some of the areas that need attention.In addition to freeing people from other tasks, automated equipment has the fundamental advantage of being able to set up each job for a specific product line to ensure optimal operating parameters.
It is fulfilled in today's technologically advanced society. Especially in the electronics industry, the product-to-market cycle for computers, disk drives and laptop products has been reduced from a few years to 12 months or less. Faster, better, and cheaper products are evolving at a rapid pace. Original equipment manufacturers (OEMs) and contract electronics manufacturers (CEMs) that want to remain competitive in the global market must increase production,
For Qat (Qaulity Acceptance Test), the challenge is to ensure that the parameters to be measured accurately represent the long-term performance of the machine. The measurement must quantify and verify the offset of the X-axis, Y-axis, and q-rotation offset from the ideal placement position.
The main driving force for chip-scale packaging is the market demand for miniaturization, especially for portable electronics. But no matter how big the drive is, new technologies always take time to get accepted because the infrastructure they support needs to be developed. The three biggest obstacles to the rapid acceptance of CSP are cost, PCB technology, and manufacturability.
Most manufacturers believe that ball-and-spring array (BGA) devices have undeniable advantages. However, some of the problems in this technology remain to be discussed further, rather than immediately, because it is difficult to trim the soldered ends. Only X-rays or Electrical test circuit method to test BGA interconnect integrity, but both methods are expensive and time consuming.
Accuracy: The difference between the measured result and the target value.
Additive Process: A method of fabricating PCB conductive traces by selectively depositing conductive materials (copper, tin, etc.) on the plies.
Adhesion: Similar to the attraction between molecules.
Aerosol: A liquid or gaseous particle that is small enough to propagate air.
This blog introduces a large domestic market prospect and a low-cost manufacturing environment, and the torch for manufacturing has been delivered to China.Although the electronics industry is experiencing a worldwide recession, China, as a bright spot in electronics manufacturing is promising
Over the years, PCBs seem to be “downgraded” in the field of electronic engineering, becoming an electronic engineer who only pays behind the scenes. Managers believe that PCB layout is a negligible problem, not a design engineer needs to care, but with digital circuits Faster and faster, RF circuits are also placed on the PCB,
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