SMT basic noun explanation

A

Accuracy: The difference between the measured result and the target value.

Additive Process: A method of fabricating PCB conductive traces by selectively depositing conductive materials (copper, tin, etc.) on the plies.

Adhesion: Similar to the attraction between molecules.

Aerosol: A liquid or gaseous particle that is small enough to propagate air.

Angle of attack: the angle between the screen printing surface and the screen printing plane.

Anisotropic adhesive: An electrically conductive substance whose particles pass current only in the Z-axis direction.

Annular ring: Conductive material around the hole.

Application specific integrated circuit: A circuit that is customized for a specific purpose.

Array: A set of elements, such as: solder balls, arranged in rows and columns.

Artwork: A conductive wiring diagram of a PCB used to produce a photo original, which can be made in any ratio, but is typically 3:1 or 4:1.

Automated test equipment: In order to evaluate the performance level, equipment designed for automatic analysis or static parameters is also used for fault isolation.

Automatic optical inspection: On an automated system, use a camera to inspect a model or object.

B

Ball grid array: A package form of an integrated circuit whose input and output points are solder balls arranged in a grid pattern on the underside of the component.

Blind via: An electrically conductive connection between the outer and inner layers of the PCB that does not continue to the other side of the board.

Bond lift-off: The failure to separate solder pins from the pad surface (board base).

Bonding agent: A glue that bonds a single layer to form a multilayer board.

Bridge: A solder that connects two conductors that should be electrically connected to each other, causing a short circuit.

Buried via: An electrically conductive connection between two or more inner layers of a PCB (ie, invisible from the outer layer).

C

CAD/CAM system: Computer-aided design uses specialized software tools to design printed circuit structures; computer-aided manufacturing converts this design into actual products. These systems include data processing and storage. Large-scale memory, input for design creation, and output device for converting stored information into graphics and reports. Capillary action: A molten solder that flows against solid surfaces that are close to each other against gravity. a natural phenomenon.

Chip on board: A hybrid technology that uses chip components that face up and are traditionally connected to the base layer of the board by flying leads.

Circuit tester: A method of testing PCBs during mass production, including: needle beds, component lead footprints, guided probes, internal traces, loading plates, empty plates, and component testing.

Cladding: A thin layer of metal foil bonded to the board to form PCB conductive traces.

Coefficient of the thermal expansion: When the surface temperature of the material increases, the measured mass per unit of temperature expands in parts per million (ppm).

Cold cleaning: An organic dissolution process in which liquid contact is followed by residue removal after soldering.

Cold solder joint: A solder joint that reflects insufficient wetting. It is characterized by gray and porous appearance due to insufficient heating or improper cleaning.

Component density: The number of components on the PCB divided by the area of the board.

Conductive epoxy: A polymeric material that passes a metal particle, usually silver, to pass it through a current.

Conductive ink: A glue used on thick film materials to form a PCB conductive wiring pattern.

Conformal coating: A thin protective coating applied to PCBs that conform to the assembled shape.

Copper foil: A thin, continuous metal foil deposited on the base layer of a circuit board as an electrical conductor of a PCB. It is easily bonded to an insulating layer and is printed. The protective layer forms a circuit pattern after corrosion. Copper mirror test: A flux corrosion test using a vacuum deposited film on a glass plate.

Cure: A change in the physical properties of a material, either by chemical reaction or by a pressure/pressureless reaction.

Cycle rate: A component patch noun used to measure the speed of a machine from picking, positioning, and returning, also known as test speed.

D

Data recorder: A device that measures and collects temperature from a thermocouple attached to a PCB at specific time intervals.

Defect: A component or circuit unit that deviates from a normally accepted feature.

Delamination: separation of the plies and separation between the plies and the conductive cover.

Desoldering: Disassemble the welding components for repair or replacement, including: suction with tin, vacuum (solder pipette) and hot extraction.

Dewetting: The process of covering and retracting the molten solder, leaving irregular residue.

DFM (design for manufacturing): The method of producing products in the most efficient way, taking into account time, cost and available resources.

Dispersant: A chemical that is added to water to increase its ability to degranulate. Documentation (documentation): Information about assembly, explaining basic design concepts, types and quantities of components and materials, specialized manufacturing instructions, and The latest version. Three types are used: prototypes and a small number of runs, standard production lines and/or production quantities, and government contracts that specify actual graphics.

Downtime: The time at which a device does not produce a product due to maintenance or failure.

Durometer: measures the rubber or plastic hardness of the blade.

E

Environmental test: A test or series of tests used to determine the overall external influence on the structural, mechanical, and functional integrity of a given component package or assembly.

Eutectic solders: Two or more metal alloys with the lowest melting point. When heated, the eutectic alloy changes directly from solid to liquid without going through the plastic phase.

F

Fabrication(): The empty board manufacturing process prior to assembly after design. The individual processes include lamination, metal addition/subtraction, drilling, plating, routing, and cleaning.

Fiducial: A special mark integrated with a circuit diagram for machine vision to find the direction and position of the wiring diagram.

Fillet: A connection formed by solder between a pad and a component lead. That is, a solder joint.

Fine-pitch technology: The surface of the surface mount component package is 0.025" (0.635mm) or less.

Fixture: A device that connects a PCB to the center of the processing machine.

Flip chip: A leadless structure that typically contains circuit elements. Designed to be electrically and mechanically applied through an appropriate number of solder balls (covered by conductive adhesive) on its face. Connected to the circuit.

Full liquidus temperature: The temperature level at which the solder reaches its maximum liquid state, which is best for good wetting.

Functional test: simulates the expected operating environment and tests the entire assembled electrical appliance.

G

Golden boy: A component or circuit assembly that has been tested and known to function to meet specifications and is used to test other units by comparison.

H

Halides: A compound containing fluorine, chlorine, bromine, iodine or antimony. It is the catalyst part of the flux and must be removed due to its corrosive nature.

Hard water: Water contains calcium carbonate and other ions that may accumulate on the inner surface of clean equipment and cause blockage.

Hardener: A chemical added to a resin to cause premature curing, ie, a curing agent.

I

In-circuit test: A component-by-component test to verify the placement and orientation of components.

J

Just-in-time (JIT is just on time): Minimize inventory by supplying materials and components directly to the production line before putting it into production.

L

Lead configuration: A conductor that extends from a component and functions as both a mechanical and electrical connection.

Line certification: Confirm that the production line is controlled in sequence and can produce reliable PCBs as required.

M

Machine vision: One or more cameras used to help find the center of a component or improve the component placement accuracy of a system.

Mean time between failure: The average statistical time interval for which a possible operating unit failure is expected, usually calculated in hours, and the results should indicate actual, expected, or calculated.

N

Nonwetting: A condition in which solder does not adhere to a metal surface. Due to contamination of the surface to be welded, the characteristic of non-wetting is the bareness of the visible base metal.

O

Omegameter: A meter used to measure the amount of ionic residue on the surface of a PCB by immersing the assembly in a mixture of alcohol and water of known high resistivity, after which it is measured and recorded as a result of ion residue. The resistivity drops. Open: The two electrical connections (pins and pads) become separate, for reasons such as insufficient solder, or if the junction pins are poorly coplanar.

Organic activated: A fluxing system of organic acids as an active agent, water soluble.

P

Packaging density: The number of components (active/passive components, connectors, etc.) placed on the PCB; expressed as low, medium, or high.

Photoploter: A basic wiring pattern processing device used to produce original PCB layouts (usually actual size) on photographic film.

Pick-and-place: A programmable machine that has a robotic arm that picks up components from an automatic feeder, moves to a fixed point on the PCB, and places it in the correct position in the correct orientation. Placement equipment: Machines that place components on the PCB in combination with high speed and accurate positioning. There are three types: SMD's mass transfer, X/Y positioning and online transfer systems, which can be combined to adapt components. Circuit board design.

R

Reflow soldering: The process of permanently attaching surface mount components to solder paste through various stages including preheating, stabilization/drying, peak reflow and cooling.

Repair: The action to restore the function of a defective assembly.

Repeatability: The process capability to accurately revert back to a characteristic target. An indicator that evaluates the processing equipment and its continuity.

Rework: Bringing an incorrect assembly back to an iterative process that meets specifications or contract requirements.

Rheology: Describes the flow of a liquid, or its viscosity and surface tension properties, such as solder paste.

S

Saponifier: An aqueous solution of organic or inorganic major ingredients and additives used to promote the removal of rosin and water-soluble fluxes, such as by dispersible cleaners.

Schematic: A diagram that uses symbols to represent the layout of a circuit, including electrical connections, components, and functions.

Semi-aqueous cleaning: Technology involving solvent cleaning, hot water washing and drying cycles.

Shadowing: In infrared reflow soldering, the component body blocks energy from certain areas, causing insufficient temperature to completely melt the solder paste.

Silver chromate test: A qualitative, halogenated ion inspection in RMA flux. (RMA reliability, maintainability and availability)

Slump: The diffusion of solder paste, glue and other materials before curing after stencil screen printing.

Solder bump: A spherical solder material bonded to the contact area of a passive or active component that acts as a connection to the circuit pad.

Solderability: The ability of a conductor (pin, pad or trace) to become wet (to become solderable) in order to form a strong connection.

Soldermask: The processing technology of printed circuit boards, except that the surface to be soldered is covered by a plastic coating.

Solids: weight percent of rosin in the flux formulation, (solids content)

Solidus: The temperature at which a solder alloy of some components begins to melt (liquefy).

Statistical process control: Analyze process output using statistical techniques to guide actions, adjust and/or maintain quality control status.

Storage life: The time during which the glue is stored and maintained useful.

Subtractive process: The circuit wiring is obtained by removing the conductive metal foil or the selected portion of the cover layer.

Surfactant: A chemical that is added to water to reduce surface tension and improve wetting.

Syringe: A gel container that is dripped through its narrow opening.

T

Tape-and-reel (package and disc): The component package for the patch, on the continuous strip, the component is placed in the pit, the pit is covered by the plastic strip, so as to be wound onto the disc for the component patch Machine.

Thermocouple: A sensor made of two different metals that produces a small DC voltage during temperature measurement when heated.

Type I, II, III assembly: PCB (I) with surface mount components on one or both sides of the board; pinned components mounted on the main surface, with SMD components mounted on one side Or two-sided hybrid technology (II); a hybrid technology in which a passive SMD component is mounted on the second side and a pin (through-hole) component is mounted on the main surface (III).

Tombstoning: A soldering defect in which the chip component is pulled to a vertical position so that the other end is not soldered.

U

Ultra-fine-pitch: The center-to-center distance of the pins and the conductor spacing are 0.010” (0.25 mm) or less.

V

Vapor degreaser: A cleaning system that suspends objects in a tank and the heated solvent vapor condenses on the surface of the object.

Void: The cavity inside the tin point formed by the flux residue trapped before the gas is released or solidified during reflow.

Y

Yield: The ratio of the components used at the end of the manufacturing process to the number of components submitted for production.

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SMT基本名词解释

A

Accuracy(精度)： 测量结果与目标值之间的差额.
Additive Process(加成工艺)：一种制造PCB导电布线的方法，通过选择性的在板层上沉淀导电材料(铜、锡等).
Adhesion(附着力)： 类似于分子之间的吸引力.
Aerosol(气溶剂)： 小到足以空气传播的液态或气体粒子.
Angle of attack(迎角)：丝印刮板面与丝印平面之间的夹角.
Anisotropic adhesive(各异向性胶)：一种导电性物质，其粒子只在Z轴方向通过电流.
Annular ring(环状圈)：钻孔周围的导电材料.
Application specific integrated circuit (ASIC特殊应用集成电路)：客户定做得用于专门用途的电路.
Array(列阵)：一组元素，比如：锡球点，按行列排列.
Artwork(布线图)：PCB的导电布线图，用来产生照片原版，可以任何比例制作，但一般为3:1或4:1.
Automated test equipment (ATE自动测试设备)：为了评估性能等级，设计用于自动分析功能或静态参数的设备，也用于故障离析.
Automatic optical inspection (AOI自动光学检查)：在自动系统上，用相机来检查模型或物体.

B
Ball grid array (BGA球栅列阵)：集成电路的包装形式，其输入输出点是在元件底面上按栅格样式排列的锡球.
Blind via(盲通路孔)：PCB的外层与内层之间的导电连接，不继续通到板的另一面.
Bond lift-off(焊接升离)：把焊接引脚从焊盘表面(电路板基底)分开的故障.
Bonding agent(粘合剂)：将单层粘合形成多层板的胶剂.
Bridge(锡桥)：把两个应该导电连接的导体连接起来的焊锡，引起短路.
Buried via(埋入的通路孔)：PCB的两个或多个内层之间的导电连接(即，从外层看不见的).

C
CAD/CAM system(计算机辅助设计与制造系统)：计算机辅助设计是使用专门的软件工具来设计印刷电路结构；计算机辅助制造把这种设计转换成实际的产品.这些系统包括用于数据处理和储存的大规模内存、用于设计创作的输入和把储存的信息转换成图形和报告的输出设备 Capillary action(毛细管作用)：使熔化的焊锡，逆着重力，在相隔很近的固体表面流动的一种自然现象.

Chip on board (COB板面芯片)：一种混合技术，它使用了面朝上胶着的芯片元件，传统上通过飞线专门地连接于电路板基底层.
Circuit tester(电路测试机)：一种在批量生产时测试PCB的方法.包括：针床、元件引脚脚印、导向探针、内部迹线、装载板、空板、和元件测试.
Cladding(覆盖层)：一个金属箔的薄层粘合在板层上形成PCB导电布线.
Coefficient of the thermal expansion(温度膨胀系数)：当材料的表面温度增加时，测量到的每度温度材料膨胀百万分率(ppm)
Cold cleaning(冷清洗)：一种有机溶解过程，液体接触完成焊接后的残渣清除.
Cold solder joint(冷焊锡点)：一种反映湿润作用不够的焊接点，其特征是，由于加热不足或清洗不当，外表灰色、多孔.
Component density(元件密度)：PCB上的元件数量除以板的面积.

Conductive epoxy(导电性环氧树脂)：一种聚合材料，通过加入金属粒子，通常是银，使其通过电流.

Conductive ink(导电墨水)：在厚胶片材料上使用的胶剂，形成PCB导电布线图.

Conformal coating(共形涂层)：一种薄的保护性涂层，应用于顺从装配外形的PCB.

Copper foil(铜箔)：一种阴质性电解材料，沉淀于电路板基底层上的一层薄的、连续的金属箔， 它作为PCB的导电体.它容易粘合于绝缘层，接受印刷保护层，腐蚀后形成电路图样. Copper mirror test(铜镜测试)：一种助焊剂腐蚀性测试，在玻璃板上使用一种真空沉淀薄膜.

Cure(烘焙固化)：材料的物理性质上的变化，通过化学反应，或有压/无压的对热反应.

Cycle rate(循环速率)：一个元件贴片名词，用来计量从拿取、到板上定位和返回的机器速度，也叫测试速度.

D

Data recorder(数据记录器)：以特定时间间隔，从着附于PCB的热电偶上测量、采集温度的设备.

Defect(缺陷)：元件或电路单元偏离了正常接受的特征.

Delamination(分层)：板层的分离和板层与导电覆盖层之间的分离.

Desoldering(卸焊)：把焊接元件拆卸来修理或更换，方法包括：用吸锡带吸锡、真空(焊锡吸管)和热拔.

Dewetting(去湿)：熔化的焊锡先覆盖、后收回的过程，留下不规则的残渣.

DFM(为制造着想的设计)：以最有效的方式生产产品的方法，将时间、成本和可用资源考虑在内.

Dispersant(分散剂)：一种化学品，加入水中增加其去颗粒的能力. Documentation(文件编制)：关于装配的资料，解释基本的设计概念、元件和材料的类型与数量、专门的制造指示和最新版本.使用三种类型：原型机和少数量运行、标准生产线和/或生产数量、以及那些指定实际图形的政府合约.

Downtime(停机时间)：设备由于维护或失效而不生产产品的时间.

Durometer(硬度计)：测量刮板刀片的橡胶或塑料硬度.

E

Environmental test(环境测试)：一个或一系列的测试，用于决定外部对于给定的元件包装或装配的结构、机械和功能完整性的总影响.

Eutectic solders(共晶焊锡)：两种或更多的金属合金，具有最低的熔化点，当加热时，共晶合金直接从固态变到液态，而不经过塑性阶段.

F

Fabrication()：设计之后装配之前的空板制造工艺，单独的工艺包括叠层、金属加成/减去、钻孔、电镀、布线和清洁.

Fiducial(基准点)：和电路布线图合成一体的专用标记，用于机器视觉，以找出布线图的方向和位置.

Fillet(焊角)：在焊盘与元件引脚之间由焊锡形成的连接.即焊点.

Fine-pitch technology (FPT密脚距技术)：表面贴片元件包装的引脚中心间隔距离为 0.025"(0.635mm)或更少.

Fixture(夹具)：连接PCB到处理机器中心的装置.

Flip chip(倒装芯片)：一种无引脚结构，一般含有电路单元. 设计用于通过适当数量的位于其面上的锡球(导电性粘合剂所覆盖)，在电气上和机械上连接于电路.

Full liquidus temperature(完全液化温度)：焊锡达到最大液体状态的温度水平，最适合于良好湿润.

Functional test(功能测试)：模拟其预期的操作环境，对整个装配的电器测试.

G

Golden boy(金样)：一个元件或电路装配，已经测试并知道功能达到技术规格，用来通过比较测试其它单元.

H

Halides(卤化物)：含有氟、氯、溴、碘或砹的化合物.是助焊剂中催化剂部分，由于其腐蚀性，必须清除.

Hard water(硬水)：水中含有碳酸钙和其它离子，可能聚集在干净设备的内表面并引起阻塞.

Hardener(硬化剂)：加入树脂中的化学品，使得提前固化，即固化剂.

I

In-circuit test(在线测试)：一种逐个元件的测试，以检验元件的放置位置和方向.

J

Just-in-time (JIT刚好准时)：通过直接在投入生产前供应材料和元件到生产线，以把库存降到最少.

L

Lead configuration(引脚外形)：从元件延伸出的导体，起机械与电气两种连接点的作用.

Line certification(生产线确认)：确认生产线顺序受控，可以按照要求生产出可靠的PCB.

M

Machine vision(机器视觉)：一个或多个相机，用来帮助找元件中心或提高系统的元件贴装精度.

Mean time between failure (MTBF平均故障间隔时间)：预料可能的运转单元失效的平均统计时间间隔，通常以每小时计算，结果应该表明实际的、预计的或计算的.

N

Nonwetting(不熔湿的)：焊锡不粘附金属表面的一种情况.由于待焊表面的污染，不熔湿的特征是可见基底金属的裸露.

O

Omegameter(奥米加表)：一种仪表，用来测量PCB表面离子残留量，通过把装配浸入已知高电阻率的酒精和水的混合物，其后，测得和记录由于离子残留而引起的电阻率下降.Open(开路)：两个电气连接的点(引脚和焊盘)变成分开，原因要不是焊锡不足，要不是连接点引脚共面性差.

Organic activated (OA有机活性的)：有机酸作为活性剂的一种助焊系统，水溶性的.

P

Packaging density(装配密度)：PCB上放置元件(有源/无源元件、连接器等)的数量；表达为低、中或高.

Photoploter(相片绘图仪)：基本的布线图处理设备，用于在照相底片上生产原版PCB布线图(通常为实际尺寸).

Pick-and-place(拾取-贴装设备)：一种可编程机器，有一个机械手臂，从自动供料器拾取元件，移动到PCB上的一个定点，以正确的方向贴放于正确的位置. Placement equipment(贴装设备)：结合高速和准确定位地将元件贴放于PCB的机器，分为三种类型：SMD的大量转移、X/Y定位和在线转移系统，可以组合以使元件适应电路板设计.

R

Reflow soldering(回流焊接)：通过各个阶段，包括：预热、稳定/干燥、回流峰值和冷却，把表面贴装元件放入锡膏中以达到永久连接的工艺过程.

Repair(修理)：恢复缺陷装配的功能的行动.

Repeatability(可重复性)：精确重返特性目标的过程能力.一个评估处理设备及其连续性的指标.

Rework(返工)：把不正确装配带回到符合规格或合约要求的一个重复过程.

Rheology(流变学)：描述液体的流动、或其粘性和表面张力特性，如，锡膏.

S

Saponifier(皂化剂)：一种有机或无机主要成份和添加剂的水溶液，用来通过诸如可分散清洁剂，促进松香和水溶性助焊剂的清除.

Schematic(原理图)：使用符号代表电路布置的图，包括电气连接、元件和功能.

Semi-aqueous cleaning(不完全水清洗)：涉及溶剂清洗、热水冲刷和烘干循环的技术.

Shadowing(阴影)：在红外回流焊接中，元件身体阻隔来自某些区域的能量，造成温度不足以完全熔化锡膏的现象.

Silver chromate test(铬酸银测试)：一种定性的、卤化离子在RMA助焊剂中存在的检查.(RMA可靠性、可维护性和可用性)

Slump(坍落)：在模板丝印后固化前，锡膏、胶剂等材料的扩散.

Solder bump(焊锡球)：球状的焊锡材料粘合在无源或有源元件的接触区，起到与电路焊盘连接的作用.

Solderability(可焊性)：为了形成很强的连接，导体(引脚、焊盘或迹线)熔湿的(变成可焊接的)能力.

Soldermask(阻焊)：印刷电路板的处理技术，除了要焊接的连接点之外的所有表面由塑料涂层覆盖住.

Solids(固体)：助焊剂配方中，松香的重量百分比，(固体含量)

Solidus(固相线)：一些元件的焊锡合金开始熔化(液化)的温度.

Statistical process control (SPC统计过程控制)：用统计技术分析过程输出，以其结果来指导行动，调整和/或保持品质控制状态.

Storage life(储存寿命)：胶剂的储存和保持有用性的时间.

Subtractive process(负过程)：通过去掉导电金属箔或覆盖层的选择部分，得到电路布线.

Surfactant(表面活性剂)：加入水中降低表面张力、改进湿润的化学品.

Syringe(注射器)：通过其狭小开口滴出的胶剂容器.

T

Tape-and-reel(带和盘)：贴片用的元件包装，在连续的条带上，把元件装入凹坑内，凹坑由塑料带盖住，以便卷到盘上，供元件贴片机用.

Thermocouple(热电偶)：由两种不同金属制成的传感器，受热时，在温度测量中产生一个小的直流电压.

Type I, II, III assembly(第一、二、三类装配)：板的一面或两面有表面贴装元件的PCB(I)；有引脚元件安装在主面、有SMD元件贴装在一面或两面的混合技术(II)；以无源SMD元件安装在第二面、引脚(通孔)元件安装在主面为特征的混合技术(III).

Tombstoning(元件立起)：一种焊接缺陷，片状元件被拉到垂直位置，使另一端不焊.

U

Ultra-fine-pitch(超密脚距)：引脚的中心对中心距离和导体间距为0.010”(0.25mm)或更小.

V

Vapor degreaser(汽相去油器)：一种清洗系统，将物体悬挂在箱内，受热的溶剂汽体凝结于物体表面.

Void(空隙)：锡点内部的空穴，在回流时气体释放或固化前夹住的助焊剂残留所形成.

Y

Yield(产出率)：制造过程结束时使用的元件和提交生产的元件数量比率.