JOYSMT
JOY TECHNOLOGY CO.,LIMITED
SMT Equipment | Electronic Component Provider
judy@joysmt.com
+86-13823724660
judy@joysmt.com
+86-13823724660
Panasonic Placement Machine
Juki Placement Machine
Fuji Placement Machine
Hitachi Placement Machine
SMT Screen Printer & Parts
SMT Feeder Storage Cart
PCB Magazine Rack
SMT Feeder Calibration Jig
+86 13823724660
+86 0755-36527060
judy@joysmt.com
evan@joysmt.com
Skype:+86 13823724660
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13823724660
Lead-free SMT can be achieved reliably if several process requirements are implemented carefully. Some of the variables to account for are listed below. The most common alloys used in lead-free SMT are tin-silver-copper alloys; these alloys all have a meting range between 217- 220°C. These alloys all melt at higher temperatures than traditional leaded solders such as the 63/37which has a melting point of 183 °C.
Key competitive advantages can be obtained through the minimization of process defects and disruptions. In today's electronic manufacturing processes there are many variables to optimize. By gaining an understanding of what the defects are, and where they come from, is a key step in the process towards defect free/six sigma manufacturing. In the last decade, Surface Mount Technology processes have been slowly converting towards the No-Clean philosophy.
Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In this study, the major focus is the investigation of PCBs with 3 different types of surface finish (ImAg, Post-Treatment ImAg, HT-OSP), SMD vs NSMD and non clean organic acid flux residue from simulating wave soldering process under MFG Test (Mixed Flowing Gas Test). The realistic mixed flowing gas (H2S, SO2, NO2, Cl2) at certain concentration of each and relative humidity are designed to accelerate creep corrosion happening.
The counterfeiting of electronic components has become a major challenge in the 21st century. The elec- tronic component supply chain has been greatly affected by widespread counterfeit incidents. A specialized service of testing, detection, and avoidance must be created to tackle the worldwide outbreak of counterfeit integrated circuits (ICs). So far, there are standards and programs in place for outlining the testing,
Flame retardants have been around since the Egyptians and Romans used alum to reduce the flammability of wood. Brominated flame retardants (BFRs) first experienced use after World War II as the substitution of wood and metal for plastics and foams resulted in materials that were much more flammable. The widespread use of BFRs initiated in the 1970s with the explosion of electronics and electrical equipment and housings.
The printed circuit board assembly industry has long embraced the “Smaller, Lighter, Faster” mantra for electronic devices, especially in our ubiquitous mobile devices. As manufacturers increase smart phone functionality and capability, designers must adopt smaller components to facilitate high-density packaging. Measuring over 40% smaller than today’s 0402M (0.4mmx0.2mm) microchip, the new 03015M (0.3mm×0.15mm) microchip epitomizes the bleeding-edge of surface mount component miniaturization.
The audio device industry is set to grow in parallel with the technology triggering across the globe. Also the entertainment and hospitality industry has created an increased demand of audio devices at large. With the enhancement coming up in consumer applications every other day, the recent trend of implementing wireless technology in audio devices has captivated the attention in the market with its growing popularities all over the electronics industry.
Be it a residential building, hospital, shopping mall, hotel, school, educational institution or any kind of a building, the security of the building is a prime facet to get a complete building solution. This also includes protecting the building, its assent and the human life from the airborne toxic industrial chemical, radiological and biological attacks or any accidental release apart from fire, water, earthquake and other security concerns. For these high value security solutions, the upgraded technology for the building safety system is now a top priority
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