JOYSMT
JOY TECHNOLOGY CO.,LIMITED
SMT Equipment | Electronic Component Provider
judy@joysmt.com
+86-13823724660
judy@joysmt.com
+86-13823724660
Panasonic Placement Machine
Juki Placement Machine
Fuji Placement Machine
Hitachi Placement Machine
SMT Screen Printer & Parts
SMT Feeder Storage Cart
PCB Magazine Rack
SMT Feeder Calibration Jig
+86 13823724660
+86 0755-36527060
judy@joysmt.com
evan@joysmt.com
Skype:+86 13823724660
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13823724660
Over the past few years a new family of laminate systems has been developed to face the increasing physical demands of withstanding Pb-free soldering processes used in the assembly of RoHS compliant products. Many of the materials have been found to perform satisfactorily for consumer type products where reflow temperatures peak around 245°C. However the high end PWB designs for the telecommunications and IT equipments typically tend to be more complex
High reliability applications for high performance computing, military, medical and industrial applications are driving electronics packaging advancements toward increased functionality with decreasing degrees of size, weight and power (SWaP) The substrate technology selected for the electronics package is a key enabling technology towards achieving SWaP. Standard printed circuit boards (PWBs) utilize dielectric materials containing glass cloth
The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder machine components. This paper describes the effects of Sn rich solders in contact with various materials and discusses alternate methods to alleviate this problem.
JOY TECHNOLOGY CO.,LIMITED committing to environmental standards have to report and try to minimize their effects. The energy consumed by manufacturing lines is significant because
machines can be working 24 hours a day. Because a pick-and- place machine will normally last seven years or more, the most significant effects come from energy consumption over the machine’s lifetime. Comparing environmental effects requires standardized measurement and labeling.
It is becoming increasingly more important to provide a low-cost point-of-care diagnostic device with the ability to detect and monitor various biological and chemical compounds. Traditional laboratories can be time-consuming and very costly. Through the combination of well-established materials and fabrication methods, it is possible to produce devices that meet the needs of many patients, healthcare and medical professionals, and environmental specialists.
Achieving optimum high-frequency printed-circuit-board (PCB) performance is not simply a matter of specifying the best possible PCB material, but can be significantly impacted by PCB fabrication practices. In addition to appropriate circuit materials and circuit design configurations to meet target performance goals, a number of PCB material-related issues can affect final performance, including the use of soldermask
In the selective soldering process, dross can be detrimental. Dross (and I use this term to encompass all surface contamination) is created in conjunction with the presence of Oxygen in two differ- ent areas of the process, and by separate means. Each must be dealt with differently in order to prevent problems.
Mobile and handheld electronics devices such as digital cam- eras, cell phones, and personal digital assistants (PDAs) are prone to be dropped in their lifetime. The drop event may result in failure of solder joints inside these devices. Recently the European Union (EU) Restriction of Hazardous Substances (RoHS) and other coun- tries’ lead-free directives banned the use of lead in consumer elec- tronics products. Thus, it is critical to understand and quantify the drop test reliability of lead-free solder joints.
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