0201 electronic component mounting process from difficult to conventional

0201 electronic component mounting process from difficult to conventional 

Although it is generally considered to be a relatively recent development,

 printed circuit boards (PCBs) have been available since the early 1950s. 

Since then, they have become smaller, lighter and more The demand for fast electronic

 products has been driving the development of electronic components, 

Lead-free process application principles in circuit board assembly

Over the past eight years, the electronics assembly industry has been testing a variety of alloys,

 hoping to find several lead-free alternatives to conventional 63Sn/37Pb eutectic systems. 

There are many options that are feasible from a technical point of view

Rapid placement of advanced packaged devices

Rapid placement of advanced packaged devices

Productivity has become the focus of discussion as surface array packages become more important,

 especially in the automotive, telecommunications, and computer applications. 

The pin pitch is less than 0.4mm, which is 0.5mm. The main problem with fine pitch QFP and TSOP

 packages is low productivity. However, since the pitch of the planar array package is not small