JOYSMT
JOY TECHNOLOGY CO.,LIMITED
SMT Equipment | Electronic Component Provider
judy@joysmt.com
+86-13823724660
judy@joysmt.com
+86-13823724660
+86 13823724660
+86 0755-36527060
judy@joysmt.com
evan@joysmt.com
Skype:+86 13823724660
WhatsApp:+86
13823724660
Location : Home > Service > Technique & Support
(1) H01 Head can't detect the head position when it is in abnormal shutdown. Remove Nozzle from Holder, put it back into change, and reset machine.
(2) change Nozzle error (for the suction nozzle error), remove the Nozzle on the Holder back to changer.
(3) sticky foreign bodies (materials) on.Nozzle,remove foreign bodies on Nozzle.
1. Introduction to safety knowledge
(1) When performing machine operation, the hand and other parts of the human body cannot be placed in the gap of the module.
(2) When the machine is working, the eyes cannot be seen inside the machine. The light emitted by the camera is too strong and may affect vision.
The combination of higher lead-free process temperatures, smaller print deposits, and temperature restraints on electrical components has created difficult challenges in optimizing the reflow process. Not only are the electronic components and the PWB at risk, but the ability to achieve a robust solder joint becomes difficult, especially if the PCB is thermally massive. In addition, the constant miniaturization of electronic components, hence smaller solder paste deposits, may require the use of smaller particle-sized powders. Both the small solder paste deposits and small particle size result in a large surface area-to- volume ratio that challenges the solder paste’s flux to effectively perform its fluxing action. The possible resulting surface oxidation can lead to voiding, graping, head-in-pillow, and other defects. Smaller components are also more susceptible to tombstoning and defects related to solder paste slump.
Unless the device has a small number of bumps (less than 25), only a small subset of bumps are recommended to define the component. These are the model bumps that will be identified by the vision algorithm. The processing time increases dramatically as the number of “find” model bumps increases. The “find” model bumps should be chosen near the corners of the component or around the perimeter of the device to provide maximum robustness of the algorithm. A small number of “find” bumps, judiciously chosen, provide excellent accuracy even for very fine pitch components.
Throughout history, as society has evolved, so has the need for bond- ing metals to metals. Whether the need for bonding metals is mechani-cal, electrical, or thermal, it can be accom- plished by using solder.Metallurgical Bonding Processes Attachment of one metal to another can be accomplished in three ways: welding, brazing, and soldering. The most signif- icant difference between these methods is the processing temperature and melt- ing temperatures of the metal. Welding is the highest temperature process,
The miniaturization of microchips is always driving force for revolution and innovation in the electronic industry. When the pitch of bumps is getting smaller and smaller the ball size has to be gradually reduced. However, the reliability of smaller ball size is getting weaker and weaker, so some traditional methods such as capillary underfilling, corner bonding and edge bonding process have been being implemented in board level assembly process to enhance drop and thermal cycling performance.
Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years, the price of silver has dramatically increased driving a desire for lower silver alloy alternatives.
The increasing demand for smaller & smaller portable electrical devices is leading to the increasing usage of extremely small components in the SMT assembly lines.With the introduction of 01005 packages in mass production, all the different stages of the line are facing new challenges: from board design, through component placement to reflow process. Each stage introduces some specific types of defect
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