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MPM Edison Screen printer
Substrate processing:
Maximum substrate size (XxY): 450mmx350mm (17.72"x13.78")
For boards larger than 14", special fixtures are required
Minimum substrate size (XxY): 50mm x 50mm (1.97" x 1.97")
Substrate thickness dimensions: FoilClamps: 0.2mm to 6.0mm (0.007" to 0.236")
EdgeLoc (edge ??clamping system): 0.8mm to 6.0mm (0.031" to 0.236")
Maximum substrate weight: 4.5kg (10lbs)
Substrate edge gap: 3.0mm (0.118")
Bottom clearance: 12.7mm (0.5") standard. Configurable 25.4mm (1.0")
Substrate clamping: fixed top clamping, table vacuum option: EdgeLoc edge clamping system
Substrate support method: magnetic thimble and support block
Printing parameters:
Maximum printing area (XxY): 450mmx350mm (17.71"x13.78")
Snap-off: 0mm to 6.35mm (0" to 0.25")
Printing speed: 305mm / sec (12.0" / sec)
Printing pressure: 0 to 20kg (0lb to 44lbs)
Template frame size: 737mmx737mm (29"x29") smaller size template optional
Image field of view (FOV): 9.0mm x 6.0mm (0.354" x 0.236")
Reference point type: standard shape reference point (see SMEMA standard), pad/opening
Camera System: Single Digital Camera - Patented Separated Optical Vision
Alignment accuracy and repeatability of the entire system: ±8 μm (±0.0003”)@6σ, Cpk≥2.0*
Technical indicators are represented by process changes in the production environment. This performance data includes printing speed, table rise and camera movement.
Actual solder paste placement accuracy and repeatability: ±15 μm (±0.0006”)@6σ, Cpk≥2.0*
Actual solder paste print position repeatability based on third-party test system verification
Cycle time: 30015 seconds including printing and wiping, and 20020 seconds including printing and wiping
Power requirements: 200 to 240VAC (±10%) single phase @50/60Hz, 15A
Compressed air requirements: 100psi@4cfm (standard operating mode) to 18cfm (vacuum wipe) (6.89bar@1.9L/s to 8.5L/s), 12.7mm (0.5") diameter tube
Machine height: (removing the lighthouse) 1580mm (62.2") at 940mm (37.0") transport height
Machine depth: 1442mm (56.77")
Machine width: 1282mm (50.47")
Minimum gap in front: 508mm (20.0")
Minimum clearance behind: 508mm (20.0")
The higher the Cpk value, the lower the variability of the process specification limits. In a qualified 6 sigma process (ie, allowing 6 standard deviations to be added or subtracted within the specification limits), Cpk ≥ 2.0. Speedline reserves the right to make changes to the technical specifications without prior notice. Please consult the factory for specific specifications.
MPM Edison Screen printer Features:
Unparalleled speed, precision and ability
Edison offers you unprecedented productivity: 15 seconds total cycle time, including printing and stencil wipe cycle times. Thanks to Edison's design, the single print cycle time is greatly reduced, saving cumulative time.
As for accuracy, no other press can be compared to Edison. Edison features built-in 8 micron alignment accuracy and 15 micron solder paste print repeatability (>2Cpk@6σ) and is verified by an independent third-party print proficiency testing agency (PCA), which means Edison's solder paste print repeatability is better than existing The best press in the industry is 25% higher.
Mechanical performance analysis (MCA) of the precision and stability of the press with special tools not only confirms the superior performance of the press, but also meets the specifications of the manufacturer. The MCA test used a special glass plate test fixture, which proved that the press performance met the manufacturer's specifications.
High productivity, optimized process
Edison's new parallel processing system is fast and greatly reduces cycle times. By reducing the total printing time per PCB to increase production capacity, there is plenty of time for key functions that are critical to improving print quality:
Low speed printing for improved stability
Slowly separate the template to optimize print resolution
Double stroke after wiping
Increase the number of wipes to increase yield
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