Optics BGA repair table

BGA repair table use instructions:

1. Preparation for rework: for the BGA chip to be reworked, determine the nozzle to be used.

2. Set the temperature of disassembly and welding, and store it, so that it can be used directly when repairing in the future.

3. Switch to the removal mode on the touch screen interface, click the repair key, and the heating head will automatically come down to heat the BGA chip.

4. After the temperature curve of the repair table is completed, the suction nozzle will automatically suck up the BGA chip, and then the mounting head will suck up the BGA and rise to the initial position. The operator can use the material box to connect the BGA chip. The removal and welding are completed.